Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

I-Aluminium core laminated foil yethusi enezindleko eziphansi I-SinkPAD PCB

Iyini i-Thermoelectric Separation Substrate?

Izendlalelo zesifunda kanye ne-thermal pad ku-substrate zihlukaniswa, futhi isisekelo sokushisa sezingxenye ezishisayo zithintana ngokuqondile ne-hot-conducting medium ukuze kuzuzwe umphumela omuhle we-thermal conductive (zero ukumelana ne-thermal).Impahla ye-substrate ngokuvamile i-substrate yensimbi (Ithusi).

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Imininingwane ye-PCB

Uhlobo lwe-PCB	I-SinkPAD II Technology
Usayizi we-PCB	50.0×60.0mm
Isimo	Amabhodi Endilinga
Uhlobo Lwensimbi Yesisekelo	I-Aluminium
Qeda Ukujiya	0.062 amayintshi (1.57 mm)
Umzila Oshisayo Oqondile	YEBO
I-Thermal Conductivity	240.0 W/mK
I-Surface Qeda	I-LF HASL
I-Glass Transition Temp.	170 degrees Celsius
I-UL Ivunyelwe	Yebo
Ukuhambisana ne-RoHS	Yebo