I-thermal conductivity CREE XML Copper MCPCB printing circuit board 5050 LED PCB hand light plate

Imininingwane yebhodi le-FR4

Ibhodi le-FR4 izici eziyinhloko zobuchwepheshe kanye nokusetshenziswa: ukuqina kokusebenza kokufakwa kukagesi, ukukhanya okuhle, indawo ebushelelezi, ayikho imigodi, ukubekezelela ukushuba kunokujwayelekile, kulungele ukusetshenziswa ekusebenzeni okuphezulu kwezidingo zokufakelwa kwe-elekthronikhi, njengepuleti lokuqinisa le-FPC, isithando somlilo, izinga lokushisa eliphezulu. ipuleti elingazweli, i-carbon diaphragm, isondo lenkanyezi yokubhukuda elinembayo, ukuhlolwa kwe-PCB, ipuleti likagesi (elisebenza ngogesi) lokuvala impahla, ipuleti lokufaka i-insulation, izingxenye ze-transformer insulation, ukufakwa kukagesi, ibhodi letheminali ikhoyili ephambukayo, ibhodi lokufakwa kwe-electronic switch, njll.


Imininingwane Yomkhiqizo

crc

 Ulwazi mayelana namandla enqubo yenkampani yethu mayelana nereferensi yakho: 

 

Into Amandla Okukhiqiza
Okubalulekile FR-4 / Hi TG FR-4 / Izinto ezisetshenziswayo zamahhala (I-ROHS Iyahambisana) /CEM-3, i-Aluminium, i-Metal based
Isendlalelo No. 1-16
Kuqedwe ukujiya kwebhodi 0.2 mm-3.8mm'(8 milli-150 mil)
 
Ukubekezelela Ukuqina Kwebhodi ±10%
Ubukhulu be-Cooper 0.5 OZ-11OZ (18 um-385 um)
I-Copper Plating Hole 18-40 um
I-Impedans Control ±10%
I-Warp & Twist 0.70%
Peel uyakwazi 0.012″(0.3mm)-0.02'(0.5mm)
Izithombe
Ububanzi be-Trace obuncane (a) 0.1mm (4 mil)  
Ububanzi besikhala obuncane (b) 0.1mm (4 mil)
Indandatho encane yonyaka 0.1mm (4 mil)  
I-SMD Pitch (a) 0.2 mm(8 mill)  
Iphimbo le-BGA (b) 0.2 mm (8 mill)
   
I-Solder Mask
I-Min Solder Mask Dam (a) 0.0635 mm (2.5mil)  
Ukususwa kwemaski ye-solder (b) 0.1mm (4 mil)
Isikhala esincane sephedi ye-SMT (c) 0.1mm (4 mil)
Ukuqina Kwemaski ye-Solder 0.0007″(0.018mm)
Izimbobo
Usayizi Wembobo Encane (CNC) 0.2 mm (8 mill)
Min Punch Hole Usayizi 0.9 mm (35 mil)
Usayizi Wembobo TOL (+/-) I-PTH:±0.075mm;NPTH: ±0.05mm
I-Hole Position TOL ±0.075mm
Ukucwenga
I-HASL 2.5 um
Ukuhola i-HASL yamahhala 2.5 um
Igolide lokucwiliswa I-Nickel 3-7um Au:1-5u”
OSP 0.2-0.5um
Uhlaka
Iphaneli yohlaka lwe-TOL (+/-) I-CNC: ±0.125mm, Ukubhoboza: ±0.15mm
Beveling 30°45°
I-engeli yomunwe wegolide 15° 30° 45° 60°
Isitifiketi ROHS, ISO9001:2008, SGS, isitifiketi se-UL

 

Usayizi 16x16mm
Ubukhulu 1.6MM
ukwelashwa kwendawo hola i-HASL yamahhala
imaski ye-solder mhlophe
ukujiya kwethusi 1oz
umthombo oholayo I-CREE XML

Imininingwane yebhodi le-FR4

Ibhodi le-FR4 izici eziyinhloko zobuchwepheshe kanye nokusetshenziswa: ukuqina kokusebenza kokufakwa kukagesi, ukukhanya okuhle, indawo ebushelelezi, ayikho imigodi, ukubekezelela ukushuba kunokujwayelekile, kulungele ukusetshenziswa ekusebenzeni okuphezulu kwezidingo zokufakelwa kwe-elekthronikhi, njengepuleti lokuqinisa le-FPC, isithando somlilo, izinga lokushisa eliphezulu. ipuleti elingazweli, i-carbon diaphragm, isondo lenkanyezi yokubhukuda elinembayo, ukuhlolwa kwe-PCB, ipuleti likagesi (elisebenza ngogesi) lokuvala impahla, ipuleti lokufaka i-insulation, izingxenye ze-transformer insulation, ukufakwa kukagesi, ibhodi letheminali ikhoyili ephambukayo, ibhodi lokufakwa kwe-electronic switch, njll.

Izici zepuleti le-aluminium

1. Ukusebenzisa ubuchwepheshe bokukhweza phezulu (SMT)

2.Ekuklanyweni kwesifunda sokusabalalisa okushisayo kuyindlela yokwelapha ephumelela kakhulu

3.Ukushisa okuphansi kokusebenza, ukuthuthukisa ukuminyana kwamandla nokuthembeka, ukwandisa impilo yesevisi yemikhiqizo;

4.Yehlisa usayizi wemikhiqizo yethu, wehlise izindleko zehardware nokuhlanganisa

5.Esikhundleni sama-substrates e-ceramic brittle, ukukhuthazela okungcono kwemishini

Ipuleti le-Aluminium lisebenzisayo: i-power hybrid IC (HTC)

1.Izisetshenziswa zomsindo: :Isikhulisi sesandisi okokufaka nokuphumayo, isikhulisi sesandisi esilinganiselwe, isikhulisi somsindo, isandisi sangaphambili, isikhulisi samandla, njll.

2.Impahla yamandla :Isilawuli esishintshayo ` Isiguquli se-DC/AC ` SW isilawuli, njll.

3.Imishini ye-elekthronikhi yokuxhumana :Ukwenyuka kwefrikhwensi ephezulu ` ukuhlunga ugesi` wokudlulisa isekethe.

I-4.Imishini ye-automation ye-Office :Amadrayivu ezimoto, njll.

5.Ikhompyutha :I-CPU board floppy drive power supply device, njll.

Imigomo enemininingwane yePCBUmhlangano

Imfuneko yobuchwepheshe:

1) I-Professional Surface-mounting and Through-hole soldering Technology

2) Osayizi abahlukahlukene njengobuchwepheshe bezingxenye ze-SMT eziyi-1206,0805,0603

3) I-ICT(In Circuit Test),FCT(Functional Circuit Test) ubuchwepheshe.

I-4) Ubuchwepheshe bokuthengiswa kabusha kwegesi ye-nitrogen ye-SMT.

5) Ulayini Womhlangano Ojwayelekile We-SMT&Solder

6) Amandla obuchwepheshe bokubekwa kwebhodi axhumene aphezulu.

yini esingakwenzela yona?

a)1-16 ungqimba FR-4 PCB ibhodi, 1-2 isendlalelo Aluminium PCB.

b) Ugqinsi lwethusi oluyi-1-6 oz.

c)0.2 mm usayizi wembobo.

d)0.1 mm ububanzi/isikhala somugqa.

e) Idizayini ye-PCB nesakhiwo.

f) Umhlangano, ukuthengwa kwengxenye.

I-PCBS yethu isetshenziselwa izinhlobo eziningi zemikhiqizo ye-elekthronikhi

Njengemishini yezokwelapha, i-CCTV, i-Power supply, i-GPS, i-UPS, i-set-top Box,

I-Telecommunication, i-LED, njll.

Imikhiqizo yethu : 

PCB, MCPCB, FPC, Multi.ungqimba lwe-PCB, i-Rigid flex PCB, i-LEDS(i-Edison, i-Cree)

Izinga eliphezulu ze-aluminium plates

I-Copper substrates

I-ayina substrates

Ama-substrates e-Ceramic

Amapuleti Akhethekile – uRogers, i-polytetrafluoroethylene, amabhodi wesekethe we-microwave we-TG high-frequency kanye namabhodi esekethe aguquguqukayo

Jwayele…

ukukhanya ophahleni, ukukhanya kwebala, ukukhanya okuphansi, ukukhanya kwedizayini, ilambu elilengayo, ukukhanya kwangaphakathi, ukukhanya kwasekhishini, ukukhanya okulengayo, ukukhanya kwendlu yangasese, i-flashlight ...

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