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Ukuphatha okushisayo I-Printed Circuit Board (PCB)-SinkPAD TM
I-SinkPAD iubuchwepheshe bokuphatha okushisayo IPrinted Circuit Board (PCB).lokho kwenza kube nokwenzeka ukukhipha ukushisa ku-LED kuye emkhathini ngokushesha nangokuphumelelayo kune-MCPCB evamile.I-SinkPAD inikeza ukusebenza okushisayo okuphakeme kwama-LED wamandla aphakathi nendawo ukuya phezulu.
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I-Aluminium core laminated foil yethusi enezindleko eziphansi I-SinkPAD PCB
Iyini i-Thermoelectric Separation Substrate?Izendlalelo zesifunda kanye ne-thermal pad ku-substrate zihlukaniswa, futhi isisekelo sokushisa sezingxenye ezishisayo zithintana ngokuqondile ne-hot-conducting medium ukuze kuzuzwe umphumela omuhle we-thermal conductive (zero ukumelana ne-thermal).Impahla ye-substrate ngokuvamile i-substrate yensimbi (Ithusi). -
Umzila oshisayo oqondile we-MCPCB kanye ne-Sink-pad MCPCB, i-Copper Core PCB, i-Copper PCB
Imininingwane Yomkhiqizo Isisekelo Sezinto:I-Alu/ yethusi Ukuqina Kwethusi:0.5/1/2/3/4 OZ Ubukhulu Bebhodi:0.6-5mm Min.Ububanzi Bomgodi:T/2mm Min.Ububanzi Bomugqa: 0.15mm Min.Isikhala Solayini:0.15mm Surface Finishing:HASL,Igolide lokucwiliswa,Igolide elikhanyayo, isiliva elicwecwe, Igama lento ye-OSP:MCPCB LED PCB Ephrintiwe ibhodi lesifunda,I-Aluminium PCB,i-copper core PCB V-cut Angle:30°,45°,60° Shape ukubekezelela:+/-0.1mm Ukubekezelela Imbobo ye-DIA:+/-0.1mm Ukuqhutshwa kwe-Thermal: 0.8-3 W/MK E-test voltage:50-250V Amandla oku-Peel-off:2.2N/mm Warp noma twist:
