FR4 Amakhono:
| Into | Imininingwane Yezobuchwepheshe |
|---|---|
| Uhlobo Lwezinto | FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA |
| Ubukhulu Bezinto | 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005" |
| Ukubalwa kwesendlalelo | Izendlalelo ezi-1 kuye kwezingu-20 |
| Ubukhulu.Usayizi Webhodi | 22.00" x 28.00" |
| IPC Ikilasi | Ikilasi II, Ikilasi III |
| I-Annular Ring | 5 mil/uhlangothi noma Okukhulu (Idizayini encane) |
| Qeda Ukucwenga | I-Solder(HASL), I-Lead Free Solder(L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Imersion Silver, Immersion Tin, Immersion Nickel, Hard Gold, njll. |
| Isisindo sethusi | Ngaphandle : Kufika ku-7oz, Ngaphakathi : kufika ku-4 oz. |
| Ukulandelela/Ububanzi besikhala | 3/3 mil |
| Usayizi omncane wephedi | 12 mil |
| Plated Slots | 0.016" |
| Imbobo Encane | 8mil;4 mil |
| Iminwe Yegolide | 1 kuya ku-4 Edge (30 kuya ku-50 Micron Gold) |
| Inani eliphakeme kakhulu lama-SMD | 0.080”- 0.020” - 0.010” |
| Uhlobo lwe-Soldermask | I-LPI Glossy, LPI-Matte |
| Umbala we-Soldermask | Okuhlaza, Okubomvu, Okuluhlaza okwesibhakabhaka, Okumnyama, Okumhlophe, Okuphuzi, Okucacile |
| Umbala Wenganekwane | Okumhlophe, Okuphuzi, Okumnyama, Okubomvu, Okuluhlaza okwesibhakabhaka. |
| Ubuncane Bobubanzi Bomzila | 0.031" |
| Amaphuzu (v-cut) | Imigqa Eqondile, Amaphuzu Eqa, CNC V-CUT. |
| Igolide | HARD, SOFT, IMMERSION (kufika ku-50 MICRON GOLD) |
| Ifomethi Yefayela Ledatha | I-Gerber RS-274x enembobo yokushumeka. |
| Fab.Ifomethi yomdwebo | Gerber Amafayela, DXF, DWG, PDF |
| I-Aspect ratio | 10:01 |
| I-Counter Sink / I-Counter Bore | Yebo |
| Lawula Impedence | Yebo |
| I-Blind Vias / Buried Vias | Yebo |
| Imaski Ecwecwayo | Yebo |
| Ikhabhoni | Yebo |
Amakhono e-MC PCB:
| Into | Imininingwane Yezobuchwepheshe |
|---|---|
| Inombolo yezendlalelo | Uhlangothi olulodwa, Izinhlangothi Ezikabili, I-MCPCB Yezendlalelo Ezine |
| Uhlobo lomkhiqizo | I-Aluminium, iCopper, i-Iron base MCPCB |
| Umphakeli we-laminate | Berquist, Ventec, Polytronics, Boyu, Wazam njll. |
| Qeda ukujiya kwebhodi | 0.2 ~ 5.0mm |
| Ukujiya kwethusi | Hoz—3oz |
| Umhlinzeki wemaski ye-solder | I-Taiyo, i-Photochem njll. |
| Umbala we-solder mask | Okumhlophe, Okumnyama, Okubomvu, Okuluhlaza okwesibhakabhaka, Okuphuzi njll. |
| Ukuqedwa kobuso | L/F HASL, OSP, ENIG, Electrolytic Silver, Immersion Tin, Imersion Silver njll. |
| Uhlobo lohlaka oluqediwe | Umzila, ukushaya, u-V-cut |
| Khothama usonte | ≤0.75% |
| Usayizi we-Min hole | 1.0mm |
| Ubukhulu.usayizi webhodi | 1500mmX610mm |
| Okuncane.usayizi webhodi | 10mmX10mm |