I-Hot Sales HDI Multilayer FR4 PCB Circuit Boards For Micro SD Card
Imininingwane Esheshayo:
Ubukhulu Bethusi: 1 oz
Ubukhulu bebhodi: 1.0mm
Okuncane.Imbobo Usayizi: 0.20mm
Okuncane.Ububanzi Bomugqa: 0.075mm
Okuncane.Isikhala Solayini:0.075mm
Ukuqedwa kobuso: ENIG
Usayizi Webhodi:Okwenziwe ngokwezifiso
Imaski ethengisa Umbala:Uyinki Oluhlaza
Ukubekezelela Ukuqina Kwebhodi:+/-10%
I-engeli ye-V-cut:25°,30°,45°,60°
Ukusonta nokugoqa:≤ 0.5%
Ifayela:Pro tel 99se/P-CAD/Auto cad/Cam350
Ukupakisha kwangaphakathi: Ukupakisha i-vacuum, isikhwama sePlastiki
Ukupakisha kwangaphandle:Ukupakisha ibhokisi elijwayelekile
Isevisi: PCB & PCBA
Isendlalelo:6 isendlalelo
Imaski kasilika:Mhlophe
Incazelo Yemikhiqizo
1 | Incazelo | Ukucaciswa kwe-PCB |
2 | Okubalulekile | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminium |
3 | Isendlalelo | 1-20 |
4 | Ukuqina Kwebhodi | 0.2mm-4.0mm |
5 | Ukubekezelela Ukuqina Kwebhodi | +/-10% |
6 | Ukujiya kwethusi | 17.5um-175um (0.5oz-5oz) |
7 | I-Min Trace Width | 0.15mm |
8 | Min Space Width | 0.15mm |
9 | I-Min Drilling Dia | 0.2mm |
10 | Ubukhulu bethusi be-PTH | 0.4-2mil(10-50um) |
11 | Ukubekezelela Etching | ±1mil(±25um) |
12 | I-V-cut angle | 25°,30°,45°,60° |
13 | I-Pearl Amandla omugqa | ≥ 6lb/in(≥ 107g/mm) |
14 | Ukulawulwa kwe-impedance nokubekezelelana | 50Ω±10% |
15 | Twist&Goqa | ≤ 0.5% |
16 | Imaski ye-solder | Okuluhlaza, Okubomvu, Okuluhlaza okwesibhakabhaka, Okumhlophe, Okumnyama, Okuphuzi |
17 | I-Surface Finish/Plating | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
18 | Isitifiketi | I-ROSH.ISO9001 |
19 | Ifayela | I-Protel 99se/P-CAD/Auto cad/Cam350 |
20 | Ukupakisha kwangaphakathi | Ukupakisha i-vacuum, isikhwama sePlastiki |
21 | Ukupakisha kwangaphandle | Ukupakishwa kwebhokisi elijwayelekile |
Imboni yethu:
Bhala umlayezo wakho lapha futhi usithumelele wona