I-36W PCB Enebhodi Labalandeli Bezinzwa Zesilingi
Imininingwane Esheshayo:
Uhlobo:I-PCB eqinile
Izinto eziyisisekelo: FR4 TG140
Ukujiya Kwethusi:1OZ/2OZ
Ubukhulu bebhodi: 1mm
Okuncane.Imbobo Usayizi: 0.01mm
Okuncane.Ububanzi Bomugqa: 0.02mm
Okuncane.Isikhala Solayini:0.01mm
Ukuqedwa kwendawo:HASL
Usayizi Webhodi:Okwenziwe ngokwezifiso
Izinga lokushisa lokusebenza: -5℃-60℃
Inani lezendlalelo:Izendlalelo Ezikabili
Izinga lokushisa lesitoreji: -20℃-80℃
I-voltage yokusebenza elinganiselwe: AC100V-250V
Umbala wemaski osodayo:Mnyama.Obomvu.Ophuzi.Omhlophe.Oluhlaza.Okuhlaza
I-PCB Standard:IPC-A-610 E
Ukuphumelela kwe-SMT:BGA.QFP.SOP.QFN.PLCC.CHIP
Ukuhlolwa Komhlangano we-PCB:Ukuhlola Okubonakalayo (okuzenzakalelayo), i-AOI, i-FCT, i-X-RAY
I-Substrates Material:Aluminium, 22F,CEM-1,CEM-3,FR4
I-voltage yokuhlukaniswa: 2.0-2.4KV(AC)
Incazelo Yomkhiqizo
Ukubambisanaimodi:
1. Idizayini ye-Schematic: i-circuit schematic ingaklanywa ngokuya ngezidingo zekhasimende.
2, PCB design: PCB umdwebo kungenziwa yakhelwe ngokuvumelana schematic kusukela ikhasimende.I-PCB kanye nesikweletu sezinto zokwakha kungahlaziywa ngesisekelo samasampula ekhasimende.
3, Idizayini yesoftware: Ukuthuthukiswa kwesoftware ye-SCM nokuklama, kungabhalwa ngokuya ngezidingo zekhasimende, nomsebenzi odingekayo.Noma bhala kabusha ingxenye ethile yesofthiwe ukuze ilingane nehadiwe yangempela yekhasimende.
Indlela yokubambisana yokukhiqiza:
1. Uhlelo olubhaliwe, i-schematic, idatha ye-PCB kanye ne-bill of materials ingathunyelwa kumakhasimende ukuze kucutshungulwe uhlelo namabhodi wesekethe.
2, Singakwazi ukuklama uhlelo lwekhasimende, sisize ukukhiqiza amabhodi wesifunda ngokuvumelana nezidingo zekhasimende.Ukubambisana kwezitayela eziningi ukuhlangabezana nezidingo zekhasimende ezahlukene.
3, Ukuthuthukiswa kanye nomklamo, imali ephansi.izindleko kuphela kanye nezindleko zokuthuthukisa ezidingekayo, ezingabuyiselwa ngemva kwenani elithile lama-oda.Ingathuthukiswa futhi yakhelwe ngokwesisekelo sezidingo zohlelo lwekhasimende.
IKHONO LOKUQHUBEKA LE-PCB :
1 | Izendlalelo | Uhlangothi Olulodwa, ungqimba olu-2 kuye ku-18 |
2 | Uhlobo lwezinto zebhodi | FR4,CEM-1,CEM-3,ibhodi le-ceramic substrate,ibhodi elisekelwe ku-aluminium, i-High-TG, i-Rogers nokuningi |
3 | I-lamination yezinto ezihlanganisiwe | Izendlalelo ezi-4 kuye kweziyisi-6 |
4 | Ubukhulu bobukhulu | 610 x 1,100mm |
5 | Ukubekezelelana kobukhulu | ±0.13mm |
6 | Ukumbozwa kokuqina kwebhodi | 0.2 kuya ku-6.00mm |
7 | Ukubekezelelana kokuqina kwebhodi | ±10% |
8 | Ubukhulu be-DK | 0.076 ukuze 6.00mm |
9 | Ububanzi bomugqa obuncane | 0.10mm |
10 | Ubuncane bendawo yomugqa | 0.10mm |
11 | Ugqinsi lwethusi lwesendlalelo sangaphandle | 8.75 ukuze 175µm |
12 | Ugqinsi lwethusi lwesendlalelo sangaphakathi | 17.5 kuya ku-175µm |
13 | Ububanzi bembobo yokubhoboza (umshini wokubhoboza) | 0.25 ukuze 6.00mm |
14 | I-diameter yembobo eqediwe (i-drill mechanical) | 0.20 ukuze 6.00mm |
15 | Ukubekezelelwa kobubanzi bembobo (umshini wokubhoboza) | 0.05mm |
16 | Ukubekezelela indawo yembobo (umshini wokubhoboza) | 0.075mm |
17 | Usayizi wembobo ye-laser | 0.10mm |
18 | Ukujiya kwebhodi kanye nesilinganiso sobubanzi bembobo | 10:1 |
19 | Uhlobo lwemaski ye-solder | Okuhlaza, Okuphuzi, Okumnyama, Okunsomi, Okuluhlaza okwesibhakabhaka, Okumhlophe nokubomvu |
20 | Ubuncane bemaski ye-solder | Ø0.10mm |
21 | Ubuncane bendandatho yokuhlukanisa imaski ye-solder | 0.05mm |
22 | I-solder mask uwoyela wepulaki ububanzi bembobo | 0.25 ukuze 0.60mm |
23 | Ukubekezelelana kokulawulwa kwe-Impedans | ±10% |
24 | Ukuqedwa kobuso | Izinga lomoya oshisayo, i-ENIG, isiliva lokucwiliswa, iplating yegolide, ithini lokucwiliswa kanye nomunwe wegolide |