[I-Inner Circuit] i-substrate ye-copper foil iqala ukusikwa ibe usayizi ofanele ukucutshungulwa nokukhiqizwa.Ngaphambi kokucindezela ifilimu ye-substrate, ngokuvamile kudingekile ukuba ucwecwe lwethusi lube roughen endaweni yepuleti ngokugaya ibhulashi kanye ne-micro etching, bese unamathisela kuyo ifilimu eyomile ye-photoresist ekushiseni okufanelekile nokucindezela.I-substrate enamathiselwe ngefilimu eyomile ye-photoresist ithunyelwa emshinini wokuchayeka e-ultraviolet ukuze ibonakale.I-photoresist izokhiqiza ukusabela kwe-polymerization ngemva kokushiswa yi-ultraviolet endaweni esobala ye-negetive, futhi isithombe somugqa ku-negetive sizodluliselwa ku-photoresist yefilimu eyomile endaweni yebhodi.Ngemva kokuklebhula ifilimu yokuzivikela endaweni yefilimu, thuthukisa futhi ususe indawo engakhanyi phezu kwefilimu nge-sodium carbonate aqueous solution, bese ugqwala futhi ukhiphe ucwecwe lwethusi oluveziwe ngesisombululo esixubile se-hydrogen peroxide ukuze wenze isekethe.Ekugcineni, i-photoresist yefilimu eyomile yasuswa yi-sodium oxide aqueous solution.
[Ukucindezela] ibhodi lesekhethi yangaphakathi ngemva kokuqedwa kufanele lihlanganiswe nephepha lethusi lesifunda elingaphandle ngefilimu ye-glass fibre resin.Ngaphambi kokucindezela, ipuleti elingaphakathi kufanele libe mnyama (i-oxygenated) ukuze lidlulise indawo yethusi futhi likhulise ukufakwa;Ubuso bethusi besifunda sangaphakathi buqinile ukuze bukhiqize ukunamathela okuhle nefilimu.Uma kugqagqana, amabhodi esekethe angaphakathi anezingqimba ezingaphezu kweziyisithupha (okuhlanganisa) azohlanganiswa ngamabili ngomshini wokugoba.Bese uyibeka kahle phakathi kwamapuleti ensimbi yesibuko anepuleti yokubamba, bese uyithumela emshinini we-vacuum ukuze uqinise futhi ubophe ifilimu ngokushisa okufanelekile nokucindezela.Imbobo eqondiwe yebhodi lesekethe elicindezelwe ibholwa umshini wokumba oqondiwe we-X-ray ozenzakalelayo njengembobo yereferensi yokuqondanisa kwamasekethe angaphakathi nangaphandle.Unqenqema lwepuleti kufanele lusikwe kahle ukuze kube lula ukucutshungulwa okulandelayo.
[Ukugaya] bhora ibhodi lesifunda ngomshini wokumba we-CNC ukuze ubhoboze imbobo yesekethe ye-interlayer kanye nembobo yokulungisa yezingxenye zokushisela.Lapho ubhomba, sebenzisa iphinikhodi ukuze ulungise ibhodi lesifunda kuthebula lomshini wokubhola ngembobo eqondiwe eyabholwa ngaphambilini, bese wengeza ipuleti lokusekela eliphansi eliyisicaba (ipuleti le-phenolic ester noma ipuleti le-wood pulp) kanye nepuleti lekhava eliphezulu (ipuleti le-aluminium) ukuze unciphise. ukwenzeka kwe-drilling burrs.
[Ipulangwe Ngembobo] ngemva kokwakhiwa kweshaneli yokuqhuba i-interlayer, ungqimba lwethusi lwensimbi luzohlelwa phezu kwalo ukuze kuqedelwe ukuqhutshwa kwesekethe ye-interlayer.Okokuqala, hlanza izinwele embobeni kanye nempushana embobeni ngokugaya ibhulashi elisindayo nokugeza okunomfutho ophezulu, bese ucwilisa bese unamathisela ithini odongeni lwembobo ehlanziwe.
[Ithusi Eliyinhloko] isendlalelo se-palladium colloidal, bese sincishiswa sibe yi-palladium yensimbi.Ibhodi lesifunda licwiliswa kusixazululo se-chemical yethusi, futhi i-ion yethusi esixazululweni iyancishiswa futhi ifakwe odongeni lwembobo nge-catalysis yensimbi ye-palladium ukuze yakhe isifunda se- through-hole.Khona-ke, ungqimba lwethusi kumgodi wokudlula luqiniswa yi-copper sulfate bath electroplating ibe ugqinsi olwanele ukumelana nomthelela wokucutshungulwa okulandelayo nendawo yesevisi.
[Umugqa Wangaphandle Wethusi Wesibili] ukukhiqizwa kokudluliswa kwesithombe somugqa kufana nalokho komugqa wangaphakathi, kodwa ekubhalweni komugqa, uhlukaniswe ngezindlela zokukhiqiza ezinhle nezingezinhle.Indlela yokukhiqiza yefilimu engalungile ifana nokukhiqizwa kwesekethe yangaphakathi.Iqedwa ngokufaka ithusi ngokuqondile futhi isuse ifilimu ngemva kokuthuthukiswa.Indlela yokukhiqiza yefilimu ephozithivu iwukwengeza ithusi lesibili lokucwecwa ngothayela ngemva kokuthuthukiswa (umthofu wethini kule ndawo uzogcinwa njengendlela yokumelana ne-etching esinyathelweni sakamuva sokucwiliswa kwethusi).Ngemuva kokukhipha ifilimu, i-foil yethusi eveziwe iyagqwala futhi isuswe nge-alkaline ammonia ne-copper chloride exutshwe nesixazululo ukuze kwakheke indlela yocingo.Okokugcina, sebenzisa isixazululo sokukhumula umthofu we-tin ukuze ucwebe ungqimba lomthofu we-tin oye wathatha umhlalaphansi ngempumelelo (ezinsukwini zokuqala, ungqimba lomthofu we-tin lwalugcinwa futhi lusetshenziselwa ukugoqa ungqimba njengongqimba oluyisivikelo ngemuva kokuncibilika kabusha, kodwa manje seluncibilika kakhulu. engasetshenziswa).
[I-Anti Welding Ink Text Printing] upende wasekuqaleni oluhlaza wakhiqizwa ngokushisisa ngokuqondile (noma imisebe ye-ultraviolet) ngemva kokuphrinta kwesikrini ukuze kuqiniswe ifilimu kapende.Kodwa-ke, ngesikhathi sokunyathelisa nokuqinisa, ngokuvamile kubangela ukuba upende oluhlaza ungene endaweni yethusi yokuxhumana kwetheminali yomugqa, okuholela enkingeni yengxenye yokushisela nokusetshenziswa.Manje, ngaphezu kokusetshenziswa kwamabhodi wesekethe alula futhi aqinile, akhiqizwa kakhulu ngopende oluhlaza okhanyayo.
Umbhalo, uphawu lokuhweba noma ingxenye yenombolo edingwa ikhasimende izophrintwa ebhodini ngokuphrinta isikrini, bese u-inki wopende wombhalo uqiniswe ngokomiswa okushisa (noma imisebe ye-ultraviolet).
[Ukucutshungulwa Kokuxhumana] Upende oluhlaza ovimbela ukushisela umboza ingxenye enkulu yethusi yesekhethi, futhi izithintwa kuphela zetheminali zengxenye yokushisela, ukuhlolwa kukagesi kanye nokufakwa kwebhodi lesekethe kuvezwa.Isendlalelo esifanelekile sokuvikela sizokwengezwa kuleli phuzu lokugcina ukuze kugwenywe ukukhiqizwa kwe-oxide ekugcineni kokuxhuma i-anode (+) ekusetshenzisweni kwesikhathi eside, okuthinta ukuzinza kwesifunda futhi kubangele ukukhathazeka kokuphepha.
[Ukubumba Nokusika] ukusika ibhodi lesekhethi libe izilinganiso zangaphandle ezidingwa amakhasimende ngomshini wokubumba we-CNC (noma i-die punch).Lapho usika, sebenzisa iphinikhodi ukuze ulungise ibhodi lesifunda embhedeni (noma isikhunta) ngokusebenzisa imbobo yokubeka embozwe ngaphambilini.Ngemuva kokusika, umunwe wegolide uzogaywa nge-oblique angle ukuze kube lula ukufakwa nokusetshenziswa kwebhodi lesifunda.Ebhodini lesifunda elakhiwe ama-chips amaningi, imigqa yokunqamula emise okuka-X idinga ukungezwa ukuze kube lula amakhasimende ukuthi ahlukanise futhi ahlukanise ngemva kwe-plug-in.Okokugcina, hlanza uthuli ebhodini lesifunda kanye nezinto ezingcolile ze-ionic ezingaphezulu.
[Ukupakishwa Kwebhodi Lokuhlola] ukupakishwa okuvamile: Ukupakishwa kwefilimu ye-PE, ukupakishwa kwefilimu okuncipha ukushisa, ukupakishwa kwe-vacuum, njll.
Isikhathi sokuthumela: Jul-27-2021