Yiziphi izindawo zokulawula zenqubo yokukhiqiza eyinhloko yamabhodi esekethe anezendlalelo eziningi

Amabhodi wesekethe we-multilayer ngokuvamile achazwa njengamabhodi wesekethe angu-10-20 noma ngaphezulu wezinga eliphezulu lezendlalelo eziningi, okunzima kakhulu ukuwacubungula kunamabhodi esekethe esekayizi eziningi futhi adinga izinga eliphezulu nokuqina.Isetshenziswa kakhulu emishinini yokuxhumana, amaseva aphezulu, i-electronics yezokwelapha, izindiza, ukulawula izimboni, ezempi kanye neminye imikhakha.Eminyakeni yakamuva, isidingo semakethe samabhodi esekethe anezingqimba eziningi emikhakheni yezokuxhumana, iziteshi eziyisisekelo, ezondiza, kanye nezempi sisaqinile.
Uma kuqhathaniswa nemikhiqizo ye-PCB yendabuko, amabhodi esekethe anezingqimba eziningi anezici zebhodi eliwugqinsi, izendlalelo eziningi, imigqa eminyene, ngaphezulu ngezimbobo, usayizi weyunithi enkulu, kanye nongqimba oluncane lwe-dielectric.Izimfuneko zocansi ziphakeme.Leli phepha lichaza kafushane ubunzima obukhulu bokucubungula okuhlangatshezwane naso ekukhiqizeni amabhodi wesifunda asezingeni eliphezulu, futhi lethula amaphuzu abalulekile okulawula izinqubo ezibalulekile zokukhiqiza zamabhodi esekethe amaningi.
1. Ubunzima bokuqondanisa kwezingqimba
Ngenxa yenani elikhulu lezendlalelo ebhodini lesekethe lezendlalelo eziningi, abasebenzisi banezidingo eziphakeme neziphakeme zokulinganisa izendlalelo ze-PCB.Imvamisa, ukubekezelelana kokuqondanisa phakathi kwezingqimba kusetshenziswa ama-microns angama-75.Uma kucatshangelwa ubukhulu beyunithi yebhodi yesekethe enezingqimba eziningi, izinga lokushisa eliphezulu kanye nomswakama endaweni yokusebenzela yokuguqulwa kwezithombe, ukunqwabelana okubangelwa ukungahambisani kwamabhodi awumongo ahlukene, nendlela yokubeka i-interlayer, ukulawula okumaphakathi kwezendlalelo eziningi. ibhodi lesifunda kuba nzima nakakhulu.
Ibhodi lesekethe le-Multilayer
2. Ubunzima ekwakhiweni kwamasekhethi angaphakathi
Amabhodi wesekethe ye-Multilayer asebenzisa izinto ezikhethekile ezifana ne-TG ephezulu, isivinini esikhulu, imvamisa ephezulu, ithusi eliwugqinsi, nezingqimba ezincane ze-dielectric, ezibeka phambili izidingo eziphakeme zokwenziwa kwesekethe yangaphakathi nokulawula usayizi wesithombe.Isibonelo, ubuqotho bokudluliselwa kwesignali ye-impedance kunezela ebunzimeni bokwenziwa kwesekethe yangaphakathi.
Ububanzi nezikhala zemigqa zincane, izifunda ezivulekile nezifushane ziyengezwa, izifunda ezimfushane ziyengezwa, nezinga lokuphasa liphansi;kunezingqimba eziningi zesignali zemigqa emincane, futhi amathuba okutholwa kokuvuza kwe-AOI kungqimba yangaphakathi ayakhula;ibhodi elingaphakathi lincane, lishwabene kalula, alivezwa kahle, futhi kulula ukugoba lapho umshini wokunamathisela;Amapuleti asezingeni eliphezulu ikakhulukazi amabhodi esistimu, ubukhulu beyunithi bukhulu, futhi izindleko zokuchithwa komkhiqizo ziphezulu.
3. Ubunzima bokukhiqiza i-Compression Manufacturing
Amabhodi amaningi angaphakathi angaphakathi namabhodi angaphambi kokulungiselela abekwe phezulu, aveza nje ububi bokushelela, i-delamination, i-resin voids kanye nezinsalela zebhamuza ekukhiqizeni isitembu.Ekwakhiweni kwesakhiwo se-laminate, ukumelana nokushisa, ukumelana nokucindezela, okuqukethwe kweglue kanye nokuqina kwe-dielectric yezinto ezibonakalayo kufanele kucatshangelwe ngokugcwele, futhi uhlelo lokucindezela impahla yebhodi lesifunda elinezingqimba eziningi kufanele lwenziwe.
Ngenxa yenani elikhulu lezendlalelo, ukulawulwa kokunwetshwa nokuncipha kanye nesinxephezelo se-coefficient yosayizi akukwazi ukugcina ukuhambisana, futhi isendlalelo se-interlayer esincane esivikelayo silula, okuholela ekuhlulekeni kokuhlolwa kokuthembeka kwe-interlayer.
4. Ubunzima ekukhiqizeni ukumba
Ukusetshenziswa kwe-TG ephezulu, isivinini esikhulu, imvamisa ephezulu, kanye nezingcwecwe ezikhethekile zethusi eziwugqinsi kwandisa ubunzima bokubhoboza ukugoba, ukubhoboza ama-burrs kanye nokususwa kokungcola.Inani lezendlalelo likhulu, ukushuba kwethusi okuphelele nokuqina kwepuleti kunqwabelana, futhi ithuluzi lokumba kulula ukuliphula;inkinga yokwehluleka kwe-CAF okubangelwa i-BGA esabalaliswe kakhulu kanye nesikhala sodonga lwembobo encane;inkinga yokumba i-oblique ebangelwa ubukhulu bepuleti elilula.Ibhodi lesifunda le-PCB


Isikhathi sokuthumela: Jul-25-2022