I-Shenzhen ikhwalithi ephezulu ye-aluminium PCB MCPCB ene-Taiyo PSR-4000 uchungechunge lwemaski emhlophe ye-solder
Amandla Okukhiqiza:
into | Amandla Okukhiqiza |
Okubalulekile | FR4,CEM-1, Aluminium, Poly amide |
Isendlalelo No. | 1-12 |
Iqediwe ukujiya kwebhodi | 0.1 mm-4.0mm |
Ukubekezelela Ukuqina Kwebhodi | ±10% |
Ubukhulu be-Cooper | 0.5 OZ-3OZ (18 um-385 um) |
I-Copper Plating Hole | 18-40 um |
I-Impedans Control | ±10% |
I-Warp & Twist | 0.70% |
Peel uyakwazi | 0.012"(0.3mm)-0.02'(0.5mm) |
Izithombe
Ububanzi be-Trace obuncane (a) | 0.075mm (3mil) |
Ububanzi besikhala obuncane (b) | 0.1mm (4 mil) |
Indandatho encane yonyaka | 0.1mm (4 mil) |
I-SMD Pitch (a) | 0.2 mm(8 mill) |
Iphimbo le-BGA (b) | 0.2 mm (8 mill) |
I-Solder Mask
I-Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Ukususwa kwemaski ye-solder (b) | 0.1mm (4 mil) |
Isikhala esincane sephedi ye-SMT (c) | 0.1mm (4 mil) |
Ukuqina Kwemaski ye-Solder | 0.0007"(0.018mm) |
Izimbobo
Usayizi Wembobo Encane (CNC) | 0.2 mm (8 mill) |
Min Punch Hole Usayizi | 0.9 mm (35 mil) |
Usayizi Wembobo TOL (+/-) | I-PTH:±0.075mm;NPTH: ±0.05mm |
I-Hole Position TOL | ±0.075mm |
Ukucwenga
I-HASL | 2.5 um |
Ukuhola i-HASL yamahhala | 2.5 um |
Igolide lokucwiliswa | I-Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Uhlaka
Iphaneli yohlaka lwe-TOL (+/-) | I-CNC: ±0.125mm, Ukubhoboza: ±0.15mm |
Beveling | 30°45° |
I-engeli yomunwe wegolide | 15° 30° 45° 60° |
Isitifiketi | ROHS, ISO9001:2008, SGS, isitifiketi se-UL |
Singakwenzela:
1-12 ungqimba FR4 PCB.
1-2 ungqimba aluminium PCB.
I-PCB eguquguqukayo engu-1-4.
I-CEM-1 PCB
94VO PCB
Isevisi yokuhlanganisa i-SMT ne-DIP.
Bhala umlayezo wakho lapha futhi usithumelele wona